You can view the full text of this article for free using the link below.

Title: Effects of scale differences of microscopic texture of fine particle peened surface on adhesion behaviour of powders

Authors: Hikaru Suzumoto; Yutaka Kameyama; Hideaki Sato; Ryokichi Shimpo

Addresses: Tokyo City University, Graduate Division, 1-28-1, Tamazutsumi, Setagaya, Tokyo, 158-8557, Japan ' Tokyo City University, 1-28-1, Tamazutsumi, Setagaya, Tokyo, 158-8557, Japan ' Tokyo City University, 1-28-1, Tamazutsumi, Setagaya, Tokyo, 158-8557, Japan ' Tokyo City University, 1-28-1, Tamazutsumi, Setagaya, Tokyo, 158-8557, Japan

Abstract: Texture on the substrate possibly alters powder adhesion behaviour. As anti-adhesion performance was enhanced under the appropriate combination of texture size and powder size, we assumed 'similarity rule' for powder adhesion on the textured surfaces; reduction in the texture size could prevent finer-powders adhesion. This study attempts to examine this hypothesis. Fine particle peening (FPP) was used as the texture creation method. Steel particles (ave. 60 μm, 25 μm) and white alumina (WA) particles (ave. 80 μm, 20 μm, 4 μm) were used as projectiles. Silicon powders with diameters of 5 μm, 50 μm, and 150 μm, were employed to assess anti-adhesion performance. Results indicated the texture created with the smaller projectile showed lower anti-adhesion performance than the other for all adhering powders, except for the smallest WA particle size (4 μm). These results indicate that anti-adhesion performance does not depend solely on the texture scale.

Keywords: shot peening; fine particle peening; FPP; powder adhesion; anti-adhesion; powder detachment; surface texture; surface roughness; dimple; centrifugal force; bridge phenomenon; image processing.

DOI: 10.1504/IJAT.2023.130842

International Journal of Abrasive Technology, 2023 Vol.11 No.3, pp.184 - 195

Received: 15 Jun 2022
Accepted: 15 Oct 2022

Published online: 12 May 2023 *

Full-text access for editors Full-text access for subscribers Free access Comment on this article