Title: Two stages' performance analysis of Taiwanese IC design industry: a dynamic network slacks-based data envelopment analysis approach

Authors: Ching-Cheng Lu; Xiang Chen; Shih-Wen Lee; Shao-Yin Hsu; Kuo-Wei Chou

Addresses: Department of Business, National Open University, No. 172, Zhongzheng Road, Luzhou District, New Taipei City – 247, Taiwan ' China Academy of Financial Research, Zhejiang University of Finance and Economics, Xueyuan Street No. 18, Xiasha Higher Park, Hangzhou – 310018, China ' Department of Applied Economics, Fo Guang University, 160 Linwei Road, Jiaosi, Yilan – 26247, Taiwan ' Department of Economics, Soochow University, 56, Kueiyang Street, Sec. 1, Taipei, 10048, Taiwan ' Department of Applied Economics, Fo Guang University, No. 160, Linwei Road, Jiaosi, Yilan – 26247, Taiwan

Abstract: The integrated circuit (IC) industry has a very significant role for Taiwanese exports, since Taiwan is a trade-oriented small open economy. This paper is to assess the performance of efficiency and total factor productivity (TFP) of the 47 publicly-traded companies in Taiwan's IC design industry by applying the dynamic network non-oriented slacks-based data envelopment analysis models (DN non-oriented DEA models) to estimate dynamic efficiency score and Malmquist Index. The aim is to evaluate their production, market, overall efficiencies and the productivity change between 2010 and 2014. The dynamic efficiency measure indicates the level of efficiency increases in the first two years, then declines after. Malmquist productivity analysis shows a significant decline in the production stage between 2010 and 2014. It is suggested that Taiwanese IC design industry should strengthen the exchange of the IC design experience and try to cooperate with universities in research and development to improve production performance.

Keywords: IC design industry; dynamic network DEA; SBM; operational efficiency; Malmquist Productivity Index; MPI.

DOI: 10.1504/IJTM.2022.123009

International Journal of Technology Management, 2022 Vol.89 No.1/2, pp.93 - 123

Accepted: 29 Jun 2021
Published online: 20 May 2022 *

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