Title: Embedded wireless delay tolerant networks on chips for segmented architectures

Authors: Pablo Alejandro Ferreyra; Rubén Danilo Capkob; Alberto Fabián Gómez; Juan Andrés Fraire; Carlos José Barrientos

Addresses: LCSR-FCEFyN, GDEI-FAMAF, LABSE-FI, National University of Córdoba, IUA, Córdoba, Argentina ' LCSR-FCEFyN, National University of Córdoba, Córdoba, Argentina ' Basic Sciences Department, National University of Chilecito, La Rioja, Argentina ' CONICET – National University of Córdoba, Córdoba, Argentina; Univ Lyon, Inria, INSA Lyon, CITI, F-69621, Villeurbanne, France ' UFS Division, CONAE, Argentine National Space Activities Commission, Argentina

Abstract: Fault-tolerant systems were traditionally based on the use of local redundancies. But currently, network technologies have allowed the emergence of novel distributed alternatives. Among these, disruption tolerant networks (DTNs) are designed to be robust against all sorts of delays and disruptions. DTNs were initially applied in scenarios with long distances and variable interruption intervals between their nodes. Wireless delay tolerant networks on chips (WDTNOCs) have been recently introduced as an enabling technology that can inherit some DTNs characteristics while improving embedded systems dependability. This work presents new results regarding 'hop counts' and 'end to end delays' for linear-shaped WDTNOCs under parametric transient fault scenarios. Extensive simulation results demonstrate that it is also possible to improve system's performance and graceful degradation characteristics. Feasibility aspects regarding the required buffer sizes are also addressed. Finally, as an important application possibility, it is shown how the so-called segmented architectures can directly benefit from embedded WDTNOCs.

Keywords: wireless networks on chips; delay tolerant networks; dependability improvement; performance improvement; graceful degradation; transient faults; segmented architectures.

DOI: 10.1504/IJES.2021.121087

International Journal of Embedded Systems, 2021 Vol.14 No.6, pp.578 - 591

Received: 25 Nov 2020
Accepted: 29 Mar 2021
Published online: 24 Feb 2022 *

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