Title: Multifactor performance measure model with an application to printed circuit board industry

Authors: Chuan-Chun Wu

Addresses: Department of Information Management, I-Shou University, 1, Section 1, Hsueh-Cheng Rd., Ta-Hsu Hsiang, Kaohsiung County 840, Taiwan

Abstract: The research described in this paper contains two parts. The first part is to present an empirical investigation where financial index is considered to measure the printed circuit board performance. The second part is to examine the effects of financial index on sales and gross margin. The technique of Data Envelopment Analysis is utilised to derive the efficiency and multiple regression analysis to disclose the effects. There were remarkable results: (1) the averaged efficiency was 0.746 which, generally speaking, did not show a good performance, (2) PCB manufacturers in the group of Single-Sided Boards/Double-Sided Boards and Multi-Layer Boards manufacturers performed average efficiency was 0.7784, (3) PCB manufacturers in the group of Flexible Print Circuit (FPC) performed average efficiency was 0.8492, (4) current assets, the number of employees and operating expenses showed significant effects on both the sales and gross margin. Other research findings were addressed and discussed in this research also.

Keywords: data envelopment analysis; DEA; efficiency; financial index; printed circuit boards; PCB performance; sales; gross margin; business performance management; performance measurement; PCB industry.

DOI: 10.1504/IJBPM.2007.011495

International Journal of Business Performance Management, 2007 Vol.9 No.1, pp.43 - 57

Published online: 01 Dec 2006 *

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