Authors: Peiqi Ge, Jianfeng Meng, Zhijian Hou
Addresses: School of Mechanical Engineering, Shandong University, Jinan 250061, Shandong Province, PR China. ' School of Mechanical Engineering, Shandong University, Jinan 250061, Shandong Province, PR China. ' School of Mechanical Engineering, Shandong University, Jinan 250061, Shandong Province, PR China
Abstract: Integrated Circuit (IC) is the foundation of modern Information Technology (IT). Most of the IC is built on the monocrystalline silicon wafer. A wire saw that uses fixed abrasive diamond looped wire is developed in this research. The wire in this saw moves continually, which reduces or eliminates the influence of direction change in wire speed on wafer surface accuracy. The slicing experimental results using constant feed force and fixed abrasive diamond looped wire saw show that the cutting surface roughness Ra decreases slightly with the increase of wire speed and the surface roughness Ra increases slightly with the increase of feed force. The cutting thickness of single diamond abrasive has an obvious effect on the sliced surface roughness. There is an obvious concave damage on the sliced surface because of the diamond grit pulled-out from the wire.
Keywords: monocrystalline silicon wafers; slicing; diamond wire sawing; surface roughness; fixed abrasive diamond wire; integrated circuits; wafer fabrication; wire speed; machining; feed force; cutting thickness; surface quality.
International Journal of Machining and Machinability of Materials, 2006 Vol.1 No.3, pp.333 - 342
Published online: 24 Nov 2006 *Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article