Title: Molecular dynamics simulation of the nanometer scale cutting process

Authors: R. Rentsch, I. Inasaki

Addresses: Laboratory for Precision Machining, Dept. of Production Engineering, Bremen University, 28359 Bremen, Germany. ' Faculty of Science and Technology, Keio University, Yokohama-shi 223-8522, Japan

Abstract: In recent years, the number of Molecular Dynamics (MD) simulations in engineering has been growing steadily. In this contribution the state-of-the-art in MD cutting simulations is analysed and its capability for cutting process integrity analysis is presented. The results are based on a 3D orthogonal cutting arrangement considering many-body interactions for ductile metals as well as so-called hard and brittle materials. Despite the applied idealisations, the atomistic basis of MD simulation provides an unprecedented inside into the microscopic deformation mechanisms of the materials. Further, the MD cutting process simulations have revealed consistent results to experimental observations in terms of the general material behaviour, such as the chip formation and the elastic–plastic response, and excellent agreement regarding the material property representation and the characteristic process quantities. Finally some recent advances and applications for improving on the MD cutting process simulation are discussed.

Keywords: cutting process; molecular dynamics; simulation; integrity analysis; ductile metals; hard materials; brittle materials; microscopic deformation mechanisms; chip formation; elastic–plastic response; nanotechnology; nanomanufacturing; nanomachining.

DOI: 10.1504/IJMR.2006.010705

International Journal of Manufacturing Research, 2006 Vol.1 No.1, pp.83 - 100

Published online: 19 Aug 2006 *

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