Authors: Anuj Sharma; Tribeni Roy; Prabhat Ranjan; Debabrata Datta; R. Balasubramaniam
Addresses: Homi Bhabha National Institute, Mumbai, 400094, India ' Homi Bhabha National Institute, Mumbai, 400094, India ' Bhabha Atomic Research Centre, Mumbai, 400085, India ' Bhabha Atomic Research Centre, Mumbai, 400085, India ' Bhabha Atomic Research Centre, Mumbai, 400085, India
Abstract: Ductile and brittle materials differ in their physical and mechanical properties and pose distinct interaction with the cutting tool while nano-machining. It is thus imperative to analyse the mechanism of material removal and tool-workpiece interaction. Towards this, molecular dynamics simulation (MDS) is carried out to study the diamond tool and workpiece interaction in the nanoscale cutting of Cu (ductile material) and Si (brittle material). Results show that material removal in Cu takes place through shear deformation by dislocations formation and their propagation while in case of Si, it takes place through phase transformation of the material in cutting zone. Force analysis of both the materials shows that machinability of Cu in nanoscale cutting is better compared to Si. Furthermore, tool wear while machining of Si with sharp edge tool is due to chipping whereas radial distribution function reveals that graphitisation of the round edge tool occurs during machining of Si.
Keywords: cutting mechanism; tool wear; molecular dynamics simulation; MDS; diamond turning; nanoscale cutting; subsurface damage; deformation; dislocation; silicon; copper.
International Journal of Precision Technology, 2019 Vol.8 No.2/3/4, pp.411 - 428
Available online: 09 Jul 2019 *Full-text access for editors Access for subscribers Purchase this article Comment on this article