Title: An artifact-centric design for IoT interoperability: implementing thing artifacts with simulation-based validation

Authors: Fang Liu; JunHui Pang

Addresses: School of Information Science and Engineering, Liuzhou Institute of Technology, Liuzhou, Guangxi, China ' School of Information Science and Engineering, Liuzhou Institute of Technology, Liuzhou, Guangxi, China

Abstract: The Internet of Things (IoT) technologies have introduced a new generation of connected tools that form complex ecosystems requiring efficient and seamless design. Addressing challenges such as limited size, connectivity and storage, this study proposes a novel conceptual pattern called the 'Thing Artifact' (TA). Unlike previous approaches, which failed to provide comprehensive solutions, the TA pattern abstracts IoT tool roles into operations, lifecycles and interactions, thereby enhancing collaboration and minimising conflicts. This work applies the TA pattern to the design and realisation of an IoT ecosystem, demonstrating how it facilitates interoperability among heterogeneous IoT devices and ensures smooth operation. The findings indicate that the TA pattern improves efficiency, simplifies operations and reduces data exchange conflicts. Overall, the TA pattern marks a significant step toward a more holistic and harmonised design and implementation of IoT ecosystems, effectively addressing the typical challenges associated with such environments.

Keywords: internet of things; thing artifacts; IoT ecosystems; collaborative relationships.

DOI: 10.1504/IJIPT.2026.156307

International Journal of Internet Protocol Technology, 2026 Vol.19 No.3, pp.109 - 117

Received: 21 Apr 2025
Accepted: 11 Jun 2025
Published online: 10 Sep 2026 *

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