Diffraction pattern analysis for real time monitoring of tool wear in turning processes
by A.A.G. Bruzzone, P.M. Lonardo, A. Traverso
International Journal of Mechatronics and Manufacturing Systems (IJMMS), Vol. 2, No. 5/6, 2009

Abstract: Surface micro-geometry is a very important source of information about the chip removal process. Cutting processes are inherently non-stationary due to irreversible changes of the cutting tool geometry. The diffraction patterns obtained by a laser beam illuminating the surface of a workpiece during turning provide useful information to monitor the cutting process. The analysis of diffraction images and the relationships between the image morphology and the geometry of the scattering surface is fundamental for the development of efficient real time control techniques. This paper reports the results of experimental tests indicating the possibility offered by a set of parameters related to the intensity of diffraction images.

Online publication date: Thu, 03-Sep-2009

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