Physico-chemical and biological properties of titanium nitride doped with copper and silver by combined methods of cathodic arc evaporation and magnetron sputtering Online publication date: Wed, 18-Sep-2024
by Božana Petrović; Bojana Ilić; Vladimir Biočanin; Michal Potran; Ana Nikitović; Ilija Nasov; Vukoman Jokanović
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 18, No. 3, 2024
Abstract: Copper (Cu) and silver (Ag) doped titanium nitride (TiN) films were obtained by combination of the cathodic arc evaporation and DC magnetron sputtering, as confirmed by phase analysis performed by X-ray diffraction (XRD) and Fourier transformed infrared spectroscopy (FTIR). The films thicknesses were about 150 nm, as estimated by spectroscopic ellipsometry. Scanning electron microscopy (SEM) revealed specific film morphology with spherical particles of 20-170 nm in size. The water contact angles measurements showed good hydrophobic properties of TiN-Cu film, suitable for potential application in artificial heart valves or venous and urinary tract catheters; and very good hydrophilic properties of TiN-Ag, essential for good osteointegration, make it suitable for coating of orthopaedic implants. Cytotoxicity of the coatings, assessed using neutral red assay, showed good cytocompatibility which indicates that the films are well-designed, with Ag+ and Cu2+ release rate non-influencing its cytocompatibility.
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