Research on micro defect recognition based on deep learning
by Donghong Yang; Yude He
International Journal of Bio-Inspired Computation (IJBIC), Vol. 23, No. 4, 2024

Abstract: To improve the overall recognition accuracy for micro defects, magnetic tile defect images are taken as the research object, and a defect image recognition method based on deep learning is proposed. Using MobileNetV3 network as the basic model, the number of deep convolution and the number of channels are trimmed. Then, mish function is used to replace h-swish function as the activation function, and the training speed and recognition accuracy of the model are improved, thus realising efficient and accurate recognition of micro defect images. The simulation results show that compared with the recognition methods standard MobileNetV3 network and other classification models faster R-CNN and EfficientNet, the proposed method performs better in terms of accuracy and F1 value, reaching 99.59% and 98.75%, respectively. The proposed method can recognise the defect image more accurately, and has the advantages of high inference speed, low parameter quantity and low computational cost.

Online publication date: Fri, 28-Jun-2024

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Bio-Inspired Computation (IJBIC):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com