Int. J. of Nanomanufacturing   »   2015 Vol.11, No.5/6

 

 

Title: Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma

 

Authors: Tomáš Homola; Vadym Prysiazhnyi; Monika Stupavská

 

Addresses:
R&D Centre for Low-Cost Plasma and Nanotechnology Surface Modification, Masaryk University, Kotlářská 267/2, 611 37 Brno, Czech Republic
Faculty of Engineering, Sao Paulo State University, Guaratingueta, SP, Brazil
R&D Centre for Low-Cost Plasma and Nanotechnology Surface Modification, Masaryk University, Kotlářská 267/2, 611 37 Brno, Czech Republic

 

Abstract: In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.

 

Keywords: nano-modification; silicon wafers; surface treatment; diffuse plasma; DBD; dielectric barrier discharge; wafer surface modification; nanotechnology; surface cleaning; nano-oxidation; atmospheric pressure plasma; plasma treatment; water contact angle; wettability.

 

DOI: 10.1504/IJNM.2015.075226

 

Int. J. of Nanomanufacturing, 2015 Vol.11, No.5/6, pp.237 - 244

 

Date of acceptance: 05 Jun 2015
Available online: 08 Mar 2016

 

 

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