Modelling and optimisation of material removal rate and surface roughness in surface-electrical discharge diamond grinding process
by Shyam Sunder; Vinod Yadava
International Journal of Industrial and Systems Engineering (IJISE), Vol. 17, No. 2, 2014

Abstract: Metal matrix composites (MMCs) can be machined using electrical discharge machining (EDM) but the process is found slow. Electrical discharge diamond grinding (EDDG), which is a hybrid machining process (HMP) comprising of diamond grinding (DG) and electrical discharge grinding (EDG), has been found a viable machining method which enhances MRR and produce better surface finish. During EDDG, abrasive grains eradicate the non-conducting material particles of MMCs, and spark discharges thermally softened the surrounding binding material. In the present work, an attempt has been made for modelling of EDDG in surface grinding mode for outputs MRR and average surface roughness (R_a) and inputs wheel speed, depth of cut, workpiece speed, pulse on-time, current and duty factor. Experiments were carried out on a newly self-developed surface grinding setup for EDDG on a die sinking EDM machine for Al-10wt.%Al₂O₃ composite. Finally, weighted principal component (WPC) is proposed for optimising the machining parameters.

Online publication date: Fri, 25-Jul-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Industrial and Systems Engineering (IJISE):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com