Grinding investigations of Ti-6Al-4V parts produced using direct metal laser sintering technology
by Anil K. Srivastava; Radu Pavel
International Journal of Mechatronics and Manufacturing Systems (IJMMS), Vol. 8, No. 5/6, 2015

Abstract: The effect of various grinding parameters on the surface integrity of titanium (Ti-6Al-4V) alloy specimens produced using direct metal laser sintering (DMLS®) process have been studied. The goal has been to identify the safe grinding parameters that would result in ground surfaces free of defects such as micro-cracks, discoloration, and/or burn marks which occur due to localised high heat generated during grinding. The residual stresses have been used to quantify the effect of grinding parameters on the ground surface. The experimental results show that the grinding parameters within the range of 10.2 m/s-20.3 m/s wheel speed, 12.2 m/min-14.7 m/min feed rate, and a depth of cut smaller than 0.025 mm, with the condition that any of the combination of these parameters leading to an equivalent chip thickness lower than 0.254 µm, and a specific material removal rate lower than 4.3 mm3/s/mm will provide compressive residual stresses and can be used as safe grinding parameters.

Online publication date: Sat, 12-Dec-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Mechatronics and Manufacturing Systems (IJMMS):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com