Title: The effect of particle size on the electrical and thermal properties of recycled copper filled polyester composites
Authors: M.N.F. Pargi; Y.T. Chong; P.L. Teh; C.K. Yeoh
Addresses: Universiti Malaysia Perlis, 02600 Jejawi, Perlis, Malaysia ' Universiti Malaysia Perlis, 02600 Jejawi, Perlis, Malaysia ' Universiti Malaysia Perlis, 02600 Jejawi, Perlis, Malaysia ' Universiti Malaysia Perlis, 02600 Jejawi, Perlis, Malaysia
Abstract: Due to high product value and some related environmental issues, recycled copper was used as filler in polyester system. The waste copper was collected from the milling machine. The effects of particle size distribution of recycled copper on properties of the polyester composites were studied based on the thermal stability, coefficient of thermal expansion (CTE), electrical conductivity and hardness. It was found that addition of recycled copper has improved the thermal stability of polyester. Incorporation of recycled copper has also decreased the CTE of the composites. From the aspect of different particle size distribution, monomodal distribution shows the most stabilised thermal behaviour with the highest degradation temperature of 314.41°C. However, insignificant effects of particle size distribution on the CTE values were found. In terms of electrical properties, recycled copper filled composites with average particle size of 16 µm exhibited the highest conductivity owing to better continuity provided by coarse particles. Meanwhile, composite with monomodal distribution has shown the highest hardness value due to more rapid collision of the particles and it distributes the stresses more effectively.
Keywords: recycled copper; thermal stability; electrical conductivity; Vickers hardness; particle size distribution; polyester composites; milling waste; coefficient of thermal expansion; CTE.
International Journal of Materials Engineering Innovation, 2013 Vol.4 No.3/4, pp.291 - 301
Published online: 14 Oct 2013 *Full-text access for editors Access for subscribers Purchase this article Comment on this article