Title: A new approach of image inpainting in the wireless environment

Authors: Yang-Ta Kao; Lun-Ping Hung; Wei-Ming Chen

Addresses: Department of Commerce Technology and Management, Chihlee Institute of Technology, Taipei 22050, Taiwan ' Department of Information Management, National Taipei University of Nursing and Health Sciences, Taipei 11219, Taiwan ' Institute of Computer Science and Information Engineering, National Ilan University, I-Lan 26047, Taiwan

Abstract: The technology of image inpainting has provided an opportunity to remedy damaged films, especially when scenes cannot be reconstructed or having the difficulties to reshoot the same film. Repairing damaged films can enhance the readability of films and provide meaningful information to readers. In the field of medical treatment, medical video films offer a solid support for the clinical treatment. Thus, developing image repairing technology can enhance the quality of medical treatment. In this paper, we introduce a new algorithm of defect detection that can detect spikes and scratch line appearing in damaged films correctly. Also, another new algorithm is proposed to repair these two kinds of defects. Using vivo photography as an example, damaged film transmitted through wireless environment can be detected and repaired. Experimental results on the detection and the restoration of damaged medical video demonstrate the efficiency of our proposed algorithm outperform some well-known image inpainting algorithm.

Keywords: medical image reconstruction; spike defect detection; scratch line detection; video inpainting; motion picture restoration; medical images; damaged films; image repairing technology; interoperability; wireless networks; wireless devices; mobile devices; medical videos.

DOI: 10.1504/IJAHUC.2013.056273

International Journal of Ad Hoc and Ubiquitous Computing, 2013 Vol.14 No.1, pp.44 - 51

Received: 21 Oct 2011
Accepted: 24 Jun 2012
Published online: 06 Sep 2013 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article