Authors: Abdur-Rasheed Alao; Mohamed Konneh
Addresses: Advanced Manufacturing and Materials Processing Technology (AMMPT) Laboratory, Department of Engineering Design and Manufacture, Faculty of Engineering Building, University of Malaya, 50603 Kuala Lumpur, Malaysia. ' Department of Manufacturing and Materials Engineering, International Islamic University Malaysia (IIUM), P.O. Box 10, 50728 Kuala Lumpur, Malaysia
Abstract: Silicon substrates are difficult to grind to good surface finishes using conventional machining. Ductile mode machining is often required to have flawless machining but this requires the use of expensive machine tools. However, precision grinding using conventional machine tools could generate large amounts of ductile streaks on ground silicon surfaces under good machining conditions. High wheel rotation, slow feed rate, small indentations and small grain sizes are the practical requirements to realise precision grinding of silicon. Therefore, this study examines the feasibility of quantitative determination of the criteria to realise precision grinding of silicon on an NC milling machine with factorial experimental design. The result shows massive ductile streaks at depth of cut, 20 ?m; feed rate, 6.25 mm/min and spindle speed of 70,000 rpm with a 43 nm Ra. Spindle speed affects mostly the surface finish. The combined effects of depth of cut and feed rate on Ra and Rt which add to the complexity in the precision grinding process are investigated.
Keywords: precision grinding; silicon substrates; factorial design; surface roughness; ductile streaks; diamond pins; NC milling; experimental design; surface quality; depth of cut; feed rate.
International Journal of Materials Engineering Innovation, 2011 Vol.2 No.3/4, pp.325 - 345
Published online: 26 Mar 2015 *Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article