Authors: Frantisek Holesovsky, Michal Hrala
Addresses: Institute of Production Technology and Management, J.E.Purkyne University, Na Okraji 1001, Usti nad Labem 400 96, Czech Republic. ' Institute of Production Technology and Management, J.E.Purkyne University, Na Okraji 1001, Usti nad Labem 400 96, Czech Republic
Abstract: The friction between the grain and material characterises the grinding in the contact place of the grinding grain with the workpiece. The following elastic and plastic deformation is finished by the chip cutting. The whole process takes place in the real surroundings, where a process liquid forms. The proportion of the dimension of the mechanical and thermal loading, which is caused by the deformation and friction, predicts the surface quality – the integrity. The following experiment deals especially with the influence of the process liquid.
Keywords: process liquid reduction; grinding; surface quality; friction; deformation; chip cutting; surface integrity.
International Journal of Computational Materials Science and Surface Engineering, 2010 Vol.3 No.1, pp.43 - 51
Published online: 01 Dec 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article