Authors: Dieter Ernst
Addresses: East-West Center, Honolulu, Hawaii, USA
Abstract: This paper explores how innovation offshoring gives rise to Global Innovation Networks (GINs) in the electronics industry. The focus is on chip design. The paper documents the scope of offshoring and the progress achieved in the complexity of design stages and in capability upgrading in Asia. The paper explores the forces that are responsible for the organisational and geographical mobility of innovation within GINs emphasising their systemic nature. The paper argues that innovation offshoring is likely to accelerate Asia|s transformation from the |global factory| model to |upgrading through innovation|. But massive challenges must be mastered before Asia|s leading electronics exporting countries can exploit these opportunities. Such challenges result from the very demanding requirements that locations need to fulfil in order to qualify for R&D investments by Transnational Corporations (TNCs).
Keywords: innovation offshoring; GINs; global innovation networks; chip design; Asian electronics; TNCs; transnational corporations; TNCs; global factory; global value chains.
International Journal of Technological Learning, Innovation and Development, 2008 Vol.1 No.4, pp.551 - 576
Available online: 11 Dec 2008 *Full-text access for editors Access for subscribers Purchase this article Comment on this article