Authors: Ron A. Lawes
Addresses: MiniFAB (AUST) Pty Ltd, 1 Dalmore Drive, Caribbean Park Scoresby, 3179, Victoria, Australia
Abstract: As commercialisation of MEMS continues, integrated MEMS devices are under development, whereby the MEMS and CMOS or BICMOS technologies are brought together on the same chip. This technique is an alternative to hybrid packaging, where the MEMS and CMOS components are manufactured separately and bonded to complete the device. The cost of processing integrated MEMS devices has been analysed, using the MEMSCOST spreadsheet, showing that the MEMS component is only a few percent of the overall cost of manufacturing, even when a High-Aspect-Ratio (HAR) process is employed and even less when test and packaging costs are taken into account.
Keywords: cost modelling; integrated MEMS devices; manufacturing cost; high aspect ratio; MEMSCOST; accelerometer; cantilever; CMOS; BICMOS; microelectromechanical systems; electronics packaging.
International Journal of Technology Transfer and Commercialisation, 2008 Vol.7 No.2/3, pp.182 - 187
Available online: 18 Sep 2008 *Full-text access for editors Access for subscribers Purchase this article Comment on this article