Title: The impact of some intellectual properties on the business performance on a sample of the Shanghai and Shenzhen Stock Exchanges for the period 2019 and 2022: a moderating role of intellectual capital

Authors: Gao Yuan; Rahimi Abidin; Faisal Zulhumadi

Addresses: School of Technology Management and Logistics, UUM College of Business, Universiti Utara Malaysia, 06010 UUM Sintok, Kedah, Malaysia ' School of Technology Management and Logistics, UUM College of Business, Universiti Utara Malaysia, 06010 UUM Sintok, Kedah, Malaysia ' School of Technology Management and Logistics, UUM College of Business, Universiti Utara Malaysia, 06010 UUM Sintok, Kedah, Malaysia

Abstract: This research examines how intellectual property affects corporate performance in Chinese pharmaceutical and information technology sectors. In addition, this research examines the role of intellectual capital as a moderator in the relationship between corporate performance and intellectual property. The value added intellectual coefficient model measures intellectual capital. Between 2019 and 2022, there were 272 firm-year appraisals of IT and pharmaceutical businesses listed on the Shanghai and Shenzhen Stock Exchanges. The endogeneity problem is resolved by using fixed effects regression analysis. This research suggests that trademark and patent protection improve business performance in China's pharmaceutical and information technology industries. Except for licensing, all intellectual property positively impacts corporate performance, according to the results. IC is a key moderator in the relationship between corporate performance and IP. This is the first empirical study of intellectual property and its relationship with corporate performance in China's developing IT and pharmaceutical industries.

Keywords: intellectual properties; IPs; intellectual capital; IC; business performance; corporate performance; pharmaceutical; information technology.

DOI: 10.1504/IJLIC.2025.147350

International Journal of Learning and Intellectual Capital, 2025 Vol.22 No.2, pp.200 - 225

Received: 28 Aug 2024
Accepted: 01 Mar 2025
Published online: 14 Jul 2025 *

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