Title: Predictive model for surface accuracy in ultra-high precision single point diamond machining of monocrystalline silicon using RSM and MD

Authors: Lukman N. Abdulkadir; Khaled Abou-El-Hossein; Abubakar Ishaq Jumare; Muhammad Mukhtar Liman; Odedeyi Peter Babatunde

Addresses: Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa

Abstract: Silicon has enjoyed extensive usage in electronic devices, solar cells and infrared (IR) optics because of its high transmittance at 1.2 to 6.0 μm wavelength range. High quality optical silicon components (R_a less than 8 nm) requires appropriate choice of ductile regime machining cutting conditions that can improve surface roughness and facilitate accurate prediction. To achieve this, three factors, i.e., feed rate, rake angle and nose radius were varied while keeping cutting speed, depth of cut and clearance angle constant. An MD study of the experiment was also carried out for comparison. The result obtained showed that; BBD standard runs 5, 6, 8, 9, and 10 with R_a values between 1.8 and 7 nm are of high form accuracy and satisfied the basic requirement of R_a over the entire IR region for silicon. The MD study was also observed to conform with the R_a result as obtained in the experiment.

Keywords: surface roughness; response surface methodology; Box-Behnken; molecular dynamics; subsurface damage.

DOI: 10.1504/IJCMSSE.2020.109559

International Journal of Computational Materials Science and Surface Engineering, 2020 Vol.9 No.2, pp.105 - 133

Received: 24 Jun 2019
Accepted: 07 Dec 2019
Published online: 15 Sep 2020 *

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