Title: Predictive model for surface accuracy in ultra-high precision single point diamond machining of monocrystalline silicon using RSM and MD
Authors: Lukman N. Abdulkadir; Khaled Abou-El-Hossein; Abubakar Ishaq Jumare; Muhammad Mukhtar Liman; Odedeyi Peter Babatunde
Addresses: Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa ' Precision Engineering Laboratory, Nelson Mandela University, South Africa
Abstract: Silicon has enjoyed extensive usage in electronic devices, solar cells and infrared (IR) optics because of its high transmittance at 1.2 to 6.0 μm wavelength range. High quality optical silicon components (Ra less than 8 nm) requires appropriate choice of ductile regime machining cutting conditions that can improve surface roughness and facilitate accurate prediction. To achieve this, three factors, i.e., feed rate, rake angle and nose radius were varied while keeping cutting speed, depth of cut and clearance angle constant. An MD study of the experiment was also carried out for comparison. The result obtained showed that; BBD standard runs 5, 6, 8, 9, and 10 with Ra values between 1.8 and 7 nm are of high form accuracy and satisfied the basic requirement of Ra over the entire IR region for silicon. The MD study was also observed to conform with the Ra result as obtained in the experiment.
Keywords: surface roughness; response surface methodology; Box-Behnken; molecular dynamics; subsurface damage.
DOI: 10.1504/IJCMSSE.2020.10032001
International Journal of Computational Materials Science and Surface Engineering, 2020 Vol.9 No.2, pp.105 - 133
Received: 24 Jun 2019
Accepted: 07 Dec 2019
Published online: 15 Sep 2020 *