Title: Compressive strength of pure copper pin produced by integrating sintering and indirect additive manufacturing approach

Authors: Savan D. Fefar; Harshit K. Dave

Addresses: Department of Mechanical Engineering, S.V. National Institute of Technology, Surat, Gujrat, 395007, India ' Department of Mechanical Engineering, S.V. National Institute of Technology, Surat, Gujrat, 395007, India

Abstract: The current study investigates the viability of pressure-less sintering of copper powder using 3D-printed clay moulds, which eliminates the requirement for specialised die production. The moulds are 3D printed as mirror cavities of the part geometry using the material extrusion (MEX) 3D printing technique with three different clay materials: terracotta, porcelain and earthenware. A full factorial experimental design was employed, with three input process parameters and three levels. The selected parameters, such as sintering temperature, sintering time, and mould material, were considered as input parameters for conducting the experimental investigation. Microhardness, compression tests, and microstructural observations are carried out to evaluate the effect of input process parameters. Experimental results demonstrate a strong correlation between compressive strength, microhardness, and process parameters confirmed by microstructural analysis. The sintering temperature was the most influential factor, followed by sintering time and mould material to determine overall responses or pin strength.

Keywords: additive manufacturing; AM; pressure-less sintering; material extrusion; MEX; compression test; microhardness.

DOI: 10.1504/IJMATEI.2026.153161

International Journal of Materials Engineering Innovation, 2026 Vol.17 No.2, pp.174 - 189

Received: 21 Nov 2024
Accepted: 19 Jan 2025
Published online: 25 Apr 2026 *

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