Article Abstract

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Title: |
Review of MEMS metrology solutions |
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Author: |
James F. Nichols, Meghan Shilling, Thomas R. Kurfess
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Address: |
Applied Research Associates, 8540 Colonnade Center Drive, Ste 301, Raleigh, NC 27615, USA. ' Sandia National Laboratory, P.O. Box 5800, MS 0665, Albuquerque, NM 87185-0665, USA. ' Department of Mechanical Engineering, Carroll A. Campbell Jr. Graduate Engineering Center, International Center for Automotive Research, Clemson University, 244 Fluor Daniel Building, Clemson, SC 29634-0921, USA |
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Journal: |
International Journal of Manufacturing Technology and Management 2008 - Vol. 13, No.2/3/4 pp. 344 - 359 |
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Abstract: |
This paper serves as a review of current solutions for MEMS metrology. This survey provides an extensive and in-depth review of the current tools and their fundamental limitations. Techniques that are reviewed include tools that are extensions of semiconductor tools, scaled down versions of conventional metrology tools and entirely novel methods for MEMS inspection. |
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Keywords: |
MEMS metrology; microfabrication; SEM; scanning electron microscopy; interferometry; micro-CMMs; coordinate measuring machines; microelectromechanical systems; microengineering; MEMS inspection. |
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DOI: |
10.1504/IJMTM.2008.016781 |
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Article's references with DOI links: - Binnig, Physical Review Letters. 1986 - Vol. 56, No. 9 p. 930
- Cao, Microsystem Technologies. 2002 - Vol. 8, No. 1 p. 3
- Hall, Applied Physics Letters. 2002 - Vol. 80, No. 20 p. 3859
- LI, Journal of Materials Processing Technology. 2003 - Vol. 140, No. 1-3 p. 358
- O Mahony, Measurement Science and Technology. 2003 - Vol. 14, No. 10 p. 1807
- PEGGS, CIRP Annals - Manufacturing Technology. 1999 - Vol. 48, No. 1 p. 417
- Haitjema, IEEE Transactions on Instrumentation and Measurement. 2001 - Vol. 50, No. 6 p. 1519
- Seitz, Optical Engineering. 1993 - Vol. 32, No. 6 p. 1374
- Storment, Journal of Microelectromechanical Systems. 1994 - Vol. 3, No. 3 p. 90
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