EDMS: an engineering data management system for design supporting environments
by Yi-Ming Chent, Li-Ming Tsengl
International Journal of Computer Applications in Technology (IJCAT), Vol. 3, No. 3, 1990

Abstract: As the popularity of design supporting environments and the large volume of data created during the design process have increased, how to effectively manage the engineering data has become an interesting as well as important research topic. In this paper, we present an object-oriented engineering data management system (EDMS) that not only has the advantages of an object-oriented data model, such as flexible incorporation of application-specific rules within each object, but also has the advantages of (1) being adaptable to existing design tools, and (2) supporting both top-down and bottom-up design paradigms. The first advantage saves re-investment in new design tools, while the second promotes the reusability of design data. In addition to the detailed description of the proposed data model, a computer system design example will be presented to illustrate the application of the EDMS. The implementation mechanisms arc also explored.

Online publication date: Wed, 11-Jun-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Computer Applications in Technology (IJCAT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com