Executive Editor

• Benim, A. C., Duesseldorf University of Applied Sciences, Germany
  (alicemalprof-benim.com)

Editorial Board Members

• Abe, K., Kyushu University, Japan
• Amato, M., Italian Aerospace Research Centre (CIRA), Italy
• Baker, A. J., University of Tennessee, USA
• Bathe, K.J., Massachusetts Institute ofTechnology, USA
• Benhamadouche, S., EDF - R&D , France
• Bercovier, Michel, Hebrew University of Jerusalem, Israel
• Bhaganagar, K., University of Texas at San Antonio, USA
• Biringen, S., University of Colorado at Boulder , USA
• Biswas, G., Indian Institute of Technology, India
• Chung, T. J., The University of Alabama in Huntsville, USA
• Corcione, Massimo, Sapienza University of Rome, Italy
• Durbin, P. A., Iowa State University, USA
• Fujima, Shoichi, Ibaraki University, Japan
• Heinrich, J. C., University of New Mexico, USA
• Janoske, U., University of Wuppertal , Germany
• Jasak, H., University of Zagreb , Croatia
• Jones, I.P., ANSYS Europe Ltd, UK
• Leschziner, M. A., Imperial College London, UK
• Menter, F., ANSYS Germany GmbH, Germany
• Noll, B., German Aerospace Center (DLR), Germany
• Oclon, P., Cracow University of Technology, Poland
• Ozoe, H., Kyushu University, Japan
• Perez-Segarra, C. D., Polytechnic University of Catalonia, Spain
• Peric, Milovan, CoMeT Continuum Mechanics Technologies GmbH, Germany
• Poncet, S., Aix Marseille University, France
• Quarteroni, Alfio, Politecnico di Milano, Italy
• Ramos, J. I., University of Malaga, Spain
• Sagaut, P., Université Pierre et Marie Curie, France
• Saurel, R., Aix Marseille University, France
• Shyy, W., Hong Kong University of Science and Technology, Hong Kong SAR, China
• Stopford, P.J., ANSYS UK Ltd, UK
• Suh, S.H., Soongsil University, South Korea
• Syed, K.J., ALSTOM (Switzerland) Ltd., Switzerland
• Tao, W. Q., Xi’an Jiaotong University, China
• Vallati, Andrea, Sapienza University of Rome, Italy
• Wang, B. C., University of Manitoba , Canada
• Witt, P., CSIRO , Australia
• Zeitoun, D., Aix Marseille University, France
• Zhao, T. S., Hong Kong University of Science and Technology, Hong Kong SAR, China
• Zingg, David W., University of Toronto, Canada

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