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Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
Liqiang Zhang; Yunqing Tang; Jie Gong; Dongjing Liu; Lijia Yu; Lin Deng; Zhibao Li; Liangze Zhi
International Journal of Materials and Structural Integrity (IJMSI), 2014 Vol.8 No.1/2/3, pp.110 - 120
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