International Journal of Materials and Structural Integrity (IJMSI)

International Journal of Materials and Structural Integrity

2014 Vol.8 No.1/2/3

Special Issue on Recent Studies on the Reliability of Microelectronic Materials and Devices

Guest Editors: Professor Sung Yi and Dr. Jeong Han Kim


Pages Title and author(s)
3-20Thermal fatigue life prediction of solder joints of plastic ball grid array packages
Yin Fun Chu; Sung Yi; Phil Geng
DOI: 10.1504/IJMSI.2014.064769
21-31Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures
Kota Nakahira; Hironori Tago; Takuya Sasaki; Ken Suzuki; Hideo Miura
DOI: 10.1504/IJMSI.2014.064770
32-41Reflow of lead-free solder by microwave heating
Yang Ju; Hayato Yamauchi; Hiroki Oshima; Kensuke Tanaka
DOI: 10.1504/IJMSI.2014.064771
42-52Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
A-Mi Yu; Jae-Won Jang; Jong-Hyun Lee; Jun-Ki Kim; Mok-Soon Kim
DOI: 10.1504/IJMSI.2014.064772
53-61Evaluation of lead-free solder reliability under vibration at elevated temperature
Yong-Ho Ko; Sehoon Yoo; Chang-Woo Lee
DOI: 10.1504/IJMSI.2014.064773
62-75Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
Sung Yi
DOI: 10.1504/IJMSI.2014.064774
76-87Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints
Yongil Kim; Jaehyun Yoon; Seung-Boo Jung
DOI: 10.1504/IJMSI.2014.064775
88-97Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint
Jae-Won Jang; Sehoon Yoo; Hyo-Soo Lee; Chang-Woo Lee; Mok-Soon Kim; Jun-Ki Kim
DOI: 10.1504/IJMSI.2014.064779
98-109Multiple Al micro materials fabrication by utilising electromigration
Ryo Zanma; Masumi Saka
DOI: 10.1504/IJMSI.2014.064776

Additional Papers

110-120Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
Liqiang Zhang; Yunqing Tang; Jie Gong; Dongjing Liu; Lijia Yu; Lin Deng; Zhibao Li; Liangze Zhi
DOI: 10.1504/IJMSI.2014.064777
121-135Thermo-mechanical coupled modelling on fixed joint interface in machine tools
Shuting Wang; Shixin Fu; Chengzuo Zhang; Weixing Chen
DOI: 10.1504/IJMSI.2014.064778
136-146Vibration analysis for roll system of KOCKS mill based on ADAMS
Xiuwen Yang; Jie Gong; Yu Liu; Xiusheng Tang; Haibiao Fan; Ping Yang
DOI: 10.1504/IJMSI.2014.064780
147-160Study on crosstalk fault model and testing for SoC inter-core interconnects
Yuling Shang; Chunquan Li; Cailin Li; Ming Zhang
DOI: 10.1504/IJMSI.2014.064782
161-168Mechanical property of a graphene/silicon interface: an atomistic simulation research
Xuenan Wang; Xiusheng Tang; Jie Gong; Yu Liu; Lin Deng; Ping Yang
DOI: 10.1504/IJMSI.2014.064783
169-184A research review on deep cryogenic treatment of steels
D. Senthilkumar; I. Rajendran
DOI: 10.1504/IJMSI.2014.064784
185-207A two-stage approach optimising PCB assembly on the sequential pick-and-place machine by a score-based slot selection method and a swarm intelligence approach
Kehan Zeng; Yi Guo
DOI: 10.1504/IJMSI.2014.064781