Title: Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes

Authors: Sung Yi

Addresses: Mechanical and Materials Engineering Department, Portland State University Portland, Portland, Oregon 97207-0751, USA

Abstract: The present study is carried out to characterise the ball shear strengths of ceramic ball grid array (CBGA) and plastic ball grid array (PBGA) packages with lead-free solder pastes. Three commercially available Sn/Ag/Cu (SAC) solder pastes such as Sn 96.5/Ag3.0/Cu0.5 and 95.5/Ag3.8/Cu0.7 with a no-clean flux are employed. The effects of temperature profiles during reflow on the strength of solder joints are studied. Their printing abilities are also observed. Of particular concern for ceramic ball grid array packages is the interaction between 90/10 Pb/Sn compound solder balls and SAC solder pastes. The composition of the solder paste region between the I/O pad and the solder ball is analysed using the energy dispersive X-ray (EDX) machine.

Keywords: shear strength; solder ball joints; lead-free solder pastes; CBGA; ceramic ball grid arrays; PBGA; plastic ball grid arrays; solder joints; lead-free soldering; tin; copper; silver; no-clean flux; temperature profiles; solder reflow.

DOI: 10.1504/IJMSI.2014.064774

International Journal of Materials and Structural Integrity, 2014 Vol.8 No.1/2/3, pp.62 - 75

Published online: 21 Oct 2014 *

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