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International Journal of Materials and Structural Integrity (IJMSI)

International Journal of Materials and Structural Integrity

2008 Vol.2 No.1/2

Special Issue on Damage In Electronic Materials

Guest Editor: Dr. Leila J. Ladani

Pages	Title and author(s)
2-10	Fracture toughness characterisation of electronic materials and interfaces H. Hosokawa, A.V. Desai, M.A. Haque DOI: 10.1504/IJMSI.2008.018897
11-34	Thermomigration in lead-free solder joints Mohd F. Abdulhamid, Shidong Li, Cemal Basaran DOI: 10.1504/IJMSI.2008.018898
35-46	Impact of miniaturisation on solder joint reliability Muge Erinc, Piet J.G. Schreurs, Marc G.D. Geers DOI: 10.1504/IJMSI.2008.018899
47-63	Reliability of PWB microvias for high density package assembly Reza Ghaffarian DOI: 10.1504/IJMSI.2008.018900
64-92	Damage mechanics of solder joints – viscoplasticity, implementation, simulation, and verification Zhengfang Qian DOI: 10.1504/IJMSI.2008.018901
93-105	Effects of radiation damage in GaN and related materials S.J. Pearton, A.Y. Polyakov DOI: 10.1504/IJMSI.2008.018902
106-137	Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys Rashid K. Abu Al-Rub DOI: 10.1504/IJMSI.2008.018903
138-163	Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling Donald F. Susan, Alice C. Kilgo, Michael K. Neilsen, Paul T. Vianco DOI: 10.1504/IJMSI.2008.018904
164-172	Estimating fatigue damage model constants with maximum likelihood method Leila J. Ladani DOI: 10.1504/IJMSI.2008.018905
173-192	Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling Krishna Tunga, Suresh K. Sitaraman DOI: 10.1504/IJMSI.2008.018906