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International Journal of Materials and Product Technology (IJMPT)

International Journal of Materials and Product Technology

2003 Vol.19 No.3/4


Pages Title and author(s)
199-217Thermal and mechanical characterisation of intercalated epoxy nanocomposites
O. Becker, G. Simon, R. Varley, Y. Cheng, J. Hodgkin
DOI: 10.1504/IJMPT.2003.002506
218-227Some observations on the mechanical properties of particulate-reinforced 6061 aluminium metal matrix composites
T. Das, P. R. Munroe, S. Bandyopadhyay
DOI: 10.1504/IJMPT.2003.002507
228-246Surface finishes in injection moulding of polymeric materials and composites
S.N.R. Choudhury, A. Edwards, M. Provatas
DOI: 10.1504/IJMPT.2003.002508
247-258Use of helices for enhancing the properties of reinforced concrete beams
M.N.S. Hadi, L.C. Schmidt
DOI: 10.1504/IJMPT.2003.002509
259-274Curing starch based adhesives: microwave or conventional
A.M. Hasna
DOI: 10.1504/IJMPT.2003.002510
275-283Effect of cure pressure on the behaviour of woven carbon/epoxy composite materials
W.W. Li, A. Crosky
DOI: 10.1504/IJMPT.2003.002511
284-294Evaluation of an epoxy-bonded steel plating system for strengthening bridge decks
A. Shayan, J.G. Sanjayan, N. Swamy
DOI: 10.1504/IJMPT.2003.002512
295-303Statistical modelling of the effect of particulate SiC reinforcement phase on the peak ageing response of aluminium alloy 2124 matrix
D. Sood, G.S. Grewal, H.R. Anand
DOI: 10.1504/IJMPT.2003.002513
304-313Smart polymers with light emission ability: millennium products for intelligent displays for navigation in the transportation industry
A. Talaie, Y.K. Lee, J. Jang, D.J. Choo, S.M. Park, J.Y. Lee, S.H. Park, G. Huh, T. Taguchi, E. Maeder
DOI: 10.1504/IJMPT.2003.002514
314-323Composite based polymeric displays: an introduction to a new smart engineering approach to incorporate transition metals to the polymer matrix
A. Talaie, Y.K. Lee, J. Jang, D.J. Choo, S.M. Park, J.Y. Lee, S.H. Park, G. Huh, T. Taguchi, E. Maeder
DOI: 10.1504/IJMPT.2003.002515
324-336Computer simulation of the packing of particles
A.B. Yu, L.F. Liu, Z.P. Zhang, R.Y. Yang, R.P. Zou
DOI: 10.1504/IJMPT.2003.002516

 

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