Simulation investigation into mechanics behaviour in material removal process of ultrasonic assisted grinding of silicon carbide ceramics Online publication date: Tue, 25-Sep-2018
by Jianguo Cao; Yueming Liu; Meng Nie; Qinjian Zhang
International Journal of Abrasive Technology (IJAT), Vol. 8, No. 4, 2018
Abstract: Grinding force and stress in the ultrasonic assisted grinding (UAG) influence on the material removal behaviour. In this study, the simulation investigation of the material removal process, by ultrasonic assisted scratching (UAS) of silicon carbide using a single abrasive grain in UAG was conducted, to reveal the grinding force and stress variation behaviour. Conventional scratching (CS) without ultrasonic vibration was also carried out on the same condition for comparison. The results showed that: 1) the cutting forces in UAS undergo a periodic sinusoidal change, whereas those in CS are basically stabilised to a certain level after the tool cuts into the workpiece completely; 2) the stress distribution fields on the cross and top surfaces along the cutting direction become wider in UAS than in CS; 3) the kinetic energy of the grain consumed in UAS is bigger than that in CS, leading to the impact of the grain on the workpiece.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Abrasive Technology (IJAT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook