Investigations on material removal rate and surface roughness of meso gear by micro wire-EDM
by Xiang Chen; Yukui Wang; Zhenlong Wang
International Journal of Manufacturing Research (IJMR), Vol. 13, No. 2, 2018

Abstract: In this paper, response surface method (RSM) was used to predict and optimise the material removal rate (MRR) and the surface roughness (SR) of meso gear in micro wire electrical discharge machining (wire-EDM) process. Open voltage, pulse duration and pulse duration were considered as input factors. The numerical models of MRR and SR were established and the ANOVA analysis of MRR and SR were also conducted, showing that the models could be used to predict the experimental results effectively. For obtaining higher MRR and lower SR, the multiple response method was used to optimise the processing parameters. The optimal processing parameters were 85 V, 2329.91 pF, 13.06 μs respectively for open voltage, discharge capacitance and pulse duration. Ultimately, the meso gear was machined by micro wire-EDM using the optimal parameters, showing better machining quality. [Submitted 12 December 2016; Accepted 29 August 2017]

Online publication date: Tue, 24-Jul-2018

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Manufacturing Research (IJMR):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com