Nanofluid as a coolant for next generation high heat dissipation electronic devices
by Abdul Razak Kaladgi; Balal Hassan; Isquander Yunus; Mohammed Sami Dafedar; Amjad Khan; Mohammed Rafi; Faheem Akthar; Abdulrajak Buradi; Farooq Indikar
International Journal of Renewable Energy Technology (IJRET), Vol. 8, No. 3/4, 2017

Abstract: The development of integrated electronic devices with increase level of miniaturisation, higher performance and output has increased the cooling requirement of chips considerably. So the use of nanofluids to cool these electronic components is inevitable. In this work, an experimental investigation of heat transfer and pressure drop characteristics of rectangular and circular minichannel arrays cooled with alumina nanofluids (in rectangular minichannel) and copper nanofluids (in circular minichannel) is carried out. The study was conducted under steady forced, turbulent flow conditions keeping heat flux as a constant and varying the flow rates. For all investigated flow rates, it was observed that with increase in Reynolds number, both the Nusselt number and pressure drop increases which further lead to increase in pumping power. The Brownian motion, interaction of nanoparticles and the resulting disturbance in the boundary layer can be the possible reasons for the observed increments.

Online publication date: Wed, 03-Jan-2018

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