Simulation study on rapid solidification of eutectic Al-Cu alloy: a molecular dynamics approach Online publication date: Fri, 15-Dec-2017
by Seshadev Sahoo
International Journal of Computational Materials Science and Surface Engineering (IJCMSSE), Vol. 7, No. 1, 2017
Abstract: It has been found out that the metals and alloys produced by rapid cooling techniques have better structural and mechanical properties. The cooling rate is a critical factor affecting the resulting structure of a liquid-solid transition. The solidification of Al-33 wt% Cu is studied with the constant-volume and constant-temperature molecular dynamics technique to obtain an atomic description of structural transformation. The system is modelled by using embedded atom method (EAM) including many body interactions. Molecular dynamics simulation study based on the EAM potential is carried out to study the unidirectional solidification behaviour of Al-33 wt% Cu alloy. The radial distribution function during cooling and heating processes provides a good picture of the structural transformation, i.e., solid to liquid and again solid which has crystalline in nature. From the simulation result, it was found that the solid/liquid interface moves smoothly unidirectionally with an interface velocity of 9 m/s. This simulation study gives a clear picture of the rapid solidification of Al-Cu alloy at atomic level.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Computational Materials Science and Surface Engineering (IJCMSSE):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com