Producing parts with multiple layer thicknesses by projection stereolithography
by Pekka Lehtinen; Matti Kaivola; Harri Korhonen; Jukka Seppälä; Jouni Partanen
International Journal of Rapid Manufacturing (IJRAPIDM), Vol. 6, No. 4, 2017

Abstract: We present a novel method to increase the manufacturing speed and versatility in lithography-based additive manufacturing processes. Usually, a part made with additive manufacturing consists of equally thick layers that are fabricated upon one another. We use a projection stereolithography (PSL) system to manufacture parts containing several layer thicknesses, which reduces the manufacturing time and adds controllability to the system. The method is based on the possibility to control the cure depth by adjusting the operation wavelength. To demonstrate the applicability of the PSL system for this purpose, we used two different operation wavelengths to produce parts that include 50- and 300-µm layers. The method presented in this paper can be used in several PSL techniques to increase their performance by offering a new tool to control the layer thickness without affecting the manufacturing resolution.

Online publication date: Wed, 18-Oct-2017

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Rapid Manufacturing (IJRAPIDM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com