Quantitative testing of micro-cracks by the MFL technique based on GA-BP neural network
by Zhongchao Qiu; Ruilei Zhang; Weimin Zhang
International Journal of Manufacturing Research (IJMR), Vol. 12, No. 2, 2017

Abstract: Magnetic flux leakage (MFL) testing is one of the traditional electromagnetic non-destructive test (NDT) techniques, and the focus of the MFL technique is to predict the sizes of defects, particularly micro-cracks. In this paper, parameters identification of artificial rectangular micro-cracks ranging between 0.1-0.3 mm by the MFL technique is investigated with a BP neural network improved by a genetic algorithm (GA-BP neural network). In order to predict the sizes of artificial rectangular micro-cracks ranging between 0.1-0.3 mm, a MFL system based on anisotropic magneto-resistive (AMR) sensors is developed, and parameters identification is implemented with a GABP neural network. The results show that parameters identification of artificial rectangular micro-cracks can be implemented effectively with the developed MFL system and a GA-BP neural network, which provides a basis for predicting the sizes of the natural cracks. [Received 19 July 2016; Accepted 16 November 2016]

Online publication date: Tue, 25-Jul-2017

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Manufacturing Research (IJMR):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com