Thermal management of software changes in product lifecycle of consumer electronics
by Yoshio Muraoka; Kenichi Seki; Hidekazu Nishimura
International Journal of Product Lifecycle Management (IJPLM), Vol. 8, No. 4, 2015

Abstract: The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

Online publication date: Sat, 16-Apr-2016

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