Size effect on heat transfer performance of ZnO/Al₂O₃ interface materials
by Liqiang Zhang; Junchao Li; Chao Wang; Xiaoju Wu; Qiaoya Liu; Chunquan Li
International Journal of Materials and Structural Integrity (IJMSI), Vol. 9, No. 4, 2015

Abstract: The aim of this paper is to provide a spanscale method to investigate and estimate the interfacial thermal conductivity (ITC) of ZnO/Al₂O₃; interface from the nanoscale to the microscale situation based on the non-equilibrium molecular dynamic (NEMD) method. Comparing the simulated with the experimental data, a fitting model of the ITC from the nanoscale to microscale is built to evaluate its changing rule. The results show that the ITC increased until bulking materials from the nanoscale to microscale. The scope of size effect area reduced to 30 nm from 600 nm and 330 nm comparing with each pure material. It means that the size effect of pure ZnO or Al₂O₃ materials can be avoided by compounding with Al₂O₃ or ZnO materials. It implies a potential method for electronic material design of packaging or micro/nano manufacturing.

Online publication date: Thu, 07-Apr-2016

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Structural Integrity (IJMSI):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com