Crack growth analysis of room temperature rolled (RTR) 6351 Al alloys by XFEM
by Rajwinder Singh
International Journal of Microstructure and Materials Properties (IJMMP), Vol. 10, No. 3/4, 2015

Abstract: In this paper, the crack growth simulations are performed using extended finite element method (XFEM) on bulk, 40% and 70% room temperature rolled (RTR) 6351 Al-alloy. The properties obtained through experimentation are used for crack growth analysis. The fracture energy obtained by Charpy impact test is used as crack growth criterion for elasto-plastic crack growth simulations. The micro-structural characterisation of bulk and RTR Al-alloy is examined through optical microscope. After 40% and 70% thickness reductions, the decrease in grain size of the alloy is observed through optical micrographs. An improvement in mechanical properties has been observed for RTR samples through tensile and Charpy impact testing. The goal of this paper is to compare the fracture behaviour of as received and RTR 6351 Al alloy because it has been observed that even high strength materials may fail when loaded below their normal strength because of presence of cracks.

Online publication date: Sat, 07-Nov-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Microstructure and Materials Properties (IJMMP):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com