Integrated finite element method and response surface methodology-based modelling and simulation of single point diamond turning of silicon
by Borad M. Barkachary; Shrikrishna N. Joshi
International Journal of Machining and Machinability of Materials (IJMMM), Vol. 17, No. 3/4, 2015

Abstract: This paper presents an integrated finite element method-response surface methodology (FEM-RSM)-based approach for modelling and simulation of single point diamond turning (SPDT) operation of silicon. Initially, a two-dimensional nonlinear plain strain model of SPDT process has been developed by using FEM. The results predicted by the numerical model were validated with the experimental results available in the literature for similar process conditions and they found in good agreement. Detailed parametric studies were carried out using RSM to study the effect of cutting speed, rake angle, depth of cut and tool edge radius on machining forces. The RSM-based model was also validated by carrying out confirmation simulations and the model was found to be predicting good with mean prediction error of about 5%. It is felt that the proposed approach can be a good alternative to the costly, time consuming and tedious SPDT experimental study of silicon material.

Online publication date: Sun, 27-Sep-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Machining and Machinability of Materials (IJMMM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com