Stress-strain analysis of specimens subjected to tensile loading during moisture uptake
by Angelos Mintzas; Rui Miranda Guedes; Andrey Aniskevich
International Journal of Automotive Composites (IJAUTOC), Vol. 1, No. 2/3, 2015

Abstract: A robust and efficient numerical method for the calculation of the internal stress state that develops within structures subjected to mechanical and steady state or transient hygroscopic loading conditions, has been developed. The method encompasses a layer by layer approach whereby the structure is discretised into plies with different material properties corresponding to the different ply moisture content. The proposed method has been validated against finite element solutions, and results from its application on a fully characterised EDT (technical name) polymer binder are presented. The impact of the moisture induced viscoelastic behaviour on the structural response of the case studied is highlighted and discussed. The approach could be used for different structures operated both open-air and indoor in automotive, marine, airspace, and other applications, e.g., for interior parts in the automobile industry.

Online publication date: Fri, 10-Jul-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Automotive Composites (IJAUTOC):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com