Modelling and simulation of chemo-mechanical magnetorheological finishing (CMMRF) process Online publication date: Sat, 28-Feb-2015
by Prabhat Ranjan; R. Balasubramaniam; V.K. Suri
International Journal of Precision Technology (IJPTECH), Vol. 4, No. 3/4, 2014
Abstract: Nano-finishing is one of the emerging fields in the area of manufacturing. In the present era, nano-finished components are being developed by two different ways, i.e. soft loop as well as hard loop process; whereas soft loop process is widely used in industries. Recently, a novel nano-finishing process has been developed by combination of magnetorheological finishing (MRF) and chemo mechanical polishing (CMP), which is named as chemo-mechanical magnetorheological finishing (CMMRF) process. CMMRF process has been developed for nanofinishing of silicon and copper. Finishing parameters of CMMRF have not been studied theoretically. It is identified that the polishing pressure is a key factor of soft loop process. Hence, an analytical approach has been taken to study polishing pressure in CMMRF. In this work, a mathematical model has been developed to understand the finishing mechanism and to investigate polishing pressure with other controlling parameters. The model has been simulated and subsequently validated using experimentation.
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