Copper cementation on iron using copper sulphate solution with different organic solvents
by Priyabrata Pal; Muhammad Nazim; Ahmed Al Shoaibi; Binay K. Dutta
International Journal of Environmental Engineering (IJEE), Vol. 6, No. 4, 2014

Abstract: Cementation reaction has been used to remove copper from aqueous solution using iron. The objective of the research has to study and characterise the particles obtained during reaction and also to determine purity of the particles by using different solvents. The reactions have been carried out with a specific concentration of copper sulphate with fixed volume of different solvents and iron of standard dimensions. The size of the particles was measured using scanning electron microscopy (SEM) and copper purity using energy dispersive x-ray spectroscopy (EDX). In this study, 1-butanol, acetone, tricholoroethylene and n-heptane were used with water as solvents. It was found that 1-butanol is the most suitable with respect to the smallest size of the particles having 93.78% (by weight) of copper. It was found that solvents have considerable effect on the particle size and purity of the produced copper particles.

Online publication date: Sat, 31-Jan-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Environmental Engineering (IJEE):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com