Numerical simulation of influence factors of stress distribution of weld-bonded joint under peeling load Online publication date: Sat, 07-Feb-2015
by Zhi Li; Min You; Jianping Wang; Gang-yan Li; Li Dong-Ming
International Journal of Computer Applications in Technology (IJCAT), Vol. 50, No. 3/4, 2014
Abstract: This paper uses the elastoplastic finite element method to analyse the influence factors of stress distribution of combination effect, including welding point position, and elastic modulus. With the elastic modulus of adhesion increasing, the stress peak value of weld-bonded joints bearing the peeling load will decrease, which makes the stress concentration of welding point more evident. The combination effect of adhesive layer-welding point is mainly relying on the adhesive function between adhesive layer and welding point. If the debonding between adhesive layer and welding point happens, the combination effect will disappear and the adhesive layers hardly bear the load. The stress concentration of welding point is very evident. And the stress peak value of joint will rapidly increase, while the bearing ability and stiffness of weld-bonded joint will decline.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Computer Applications in Technology (IJCAT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook