Interfacial heat transfer properties of the typical interconnection structures in IC packaging: a multiscale study
by Liqiang Zhang; Yunqing Tang; Jie Gong; Dongjing Liu; Lijia Yu; Lin Deng; Zhibao Li; Liangze Zhi
International Journal of Materials and Structural Integrity (IJMSI), Vol. 8, No. 1/2/3, 2014

Abstract: A multiscale analysis method is put forward to evaluate the interfacial properties. The finite element method is used to estimate the thermodynamics properties of the Al-Cu interface structure in the macroscale, and the non-equilibrium molecular dynamics method is used to investigate the interfacial heat transfer in the nanoscale. The deformation and nanocracks always appear at the outside edge of interface owing to the dissimilar thermal expansion coefficients. The diffusion thickness of different atoms increases with the increase of temperature. The diffusion enhances the heat transfer with the increase of temperature in the nanoscale. The results reveal the mechanism of the interfacial heat transfer, which is helpful in the design and manufacture of IC assembly.

Online publication date: Tue, 21-Oct-2014

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