Thermal fatigue life prediction of solder joints of plastic ball grid array packages
by Yin Fun Chu; Sung Yi; Phil Geng
International Journal of Materials and Structural Integrity (IJMSI), Vol. 8, No. 1/2/3, 2014

Abstract: In the present study, the fatigue life of solder joints of plastic ball grid array packages (PBGA) under thermal cycling condition is evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behaviour of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.

Online publication date: Tue, 21-Oct-2014

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