Imposing compliance on grinding and polishing
by C.H. Liu, C-C.A. Chen, Po-I Li, Ta-Chieh Hu
International Journal of Materials and Product Technology (IJMPT), Vol. 22, No. 4, 2005

Abstract: Compliance is imposed upon the workpiece holder of a polishing/grinding system. Experiment results show that in a polishing process compliance may compensate position and geometry errors of the workpiece, and also compensate errors due to tool wear. During a grinding process it is shown that compliance may absorb high frequency disturbance from the outside, making grinding results unaffected. For a polishing system with compliance, experiment results suggest that soft springs (i.e. springs with greater values of compliance) may compensate workpiece geometry error better. Also, surface roughness decrease with increasing either translational or rotation speed of the polishing ring, and, up to a limit, a smaller pre-load depth gives rise to a smoother surface. A series of experiments based on Taguchi's method for parameter design are performed to determine better combinations of compliance with other polishing parameters, and results show that surface roughness may be greatly reduced.

Online publication date: Thu, 10-Mar-2005

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com