Numerical prediction of heat transfer from an array of simulated electronic modules
by S.G. Bhatta
International Journal of Computer Aided Engineering and Technology (IJCAET), Vol. 6, No. 2, 2014

Abstract: A three dimensional study of forced air cooling of an array of heated blocks is presented. Heated blocks represent electronic modules mounted on horizontal circuit board in a rectangular channel. Numerically, the obtained average heat transfer coefficients for the top surface of the heated blocks are compared with experimentally obtained values, and it is found that there is a good agreement between the two for the range of Reynolds numbers, 7,625 to 30,500, with hydraulic diameter as characteristic length. It is also observed that the first set of modules facing the flow is the coolest, and the heat transfer from other module sets decreases asymptotically. The percentage decrease in the heat transfer for the successive module sets compared to the first module set remains almost unchanged with the increase in Reynolds number. Hot spots are found behind each module where there is flow restriction. A correlation is developed to predict heat transfer from individual module sets.

Online publication date: Tue, 17-Jun-2014

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