Characteristics of gate-all-around polycrystalline silicon channel SONOS flash memory
by Joo Yun Seo; Sang-Ho Lee; Se Hwan Park; Wandong Kim; Do-Bin Kim; Byung-Gook Park
International Journal of Nanotechnology (IJNT), Vol. 11, No. 1/2/3/4, 2014

Abstract: In this study, the gate-all-around (GAA) poly-Si channel flash memories with a nitride charge trap layer (Si3N4) have been successfully fabricated. Electrical characteristics of fabricated devices including the threshold voltage shift with program/erase operation have been investigated. Gate structures were formed differently according to each defined channel width. Results show that devices with the gate-all-around structure have superior program efficiency. To investigate the effect of gate structure on the program efficiency, TCAD simulation was carried out. Another issue of the fabricated devices is poor erase operation due to the quality of the blocking oxide. This issue has been studied through the capacitor composed of the same stack structure, and the way to improve the erase operation has been proposed.

Online publication date: Sat, 15-Nov-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nanotechnology (IJNT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com